超高精度晶圓對位置放機

超高精度晶圓對位置放機

 

·          Modular machine concept
·          ±1 µm @3s placement accuracy
·          Base platform for imprinting lithography process on wafer scale, useful for micro-optics and micro-fluidics on 6” / 8” wafer
·          Base platform for wafer-spacer or wafer-wafer bonding process on 6” / 8” wafer
·          UV-Curing option for spot and line curing
·          Contact-less wedge compensation for safe and accurate device handling
·          Proximity gap alignment for transparent and non-transparent materials
·          Various alignment procedures for flexible product adaptation
·          Standalone programming environment for product management
·          Centralised data storage as base for multiple equipment use in production environment
·          Fully automated device loading and unloading