PROXIMITY GAP ALIGNMENT

·         Fully automated device loading and unloading for 6”/8” Wafers
·         Vibration damping with pneumatic piston-gimbal isolators
·         Alignment for transparent and non-transparent materials
·         Stacking height capabilities up to 20mm
·         Bonding force of 240N can be supplied, this relates on the following bonding forces
◦          6” wafer: approx. 13kN/m2
◦          8” wafer: approx. 7.4kN/m2