超高精度晶圓對位置放機
ESP-ENGINEERING 為一家專門致力於超高精度 (Accruacy < 1µm) ,非接觸式,六軸對位晶圓對位置放機開發的公司, 其產品可應用於生物晶片,半導體產業, 微機電產業, 光電產業及光纖通訊產業, 廣受一線大廠採用, 且可提供Total Solution或設備整合(例如Eutectic) 予客戶應用.
晶圓對位置放機(Wafer Placing Unit)
Micro replication / Imprinting lithography
Wafer-Spacer bonding / Wafer-Wafer bonding
晶圓分離裝置(Wafer Seperation Unit)
The manual wafer separation unit.
晶圓清潔系統(Wafer Cleaning System)
The system uses a brushing cleansing liquid with two selectable and fill level controlled solvent receptacles.